国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） H05（2）
IPC小类 C08J（3）
IPC C08J005/24（3）
发明人 CHEN C（2） HE J（2） ZHANG W（2）
公开年 2023（3）
申请年 2022（2） 
专利权人 CHANGSHU SHE.（2） SHENGYI TECH.（2）

5G antenna cover used in mobile communication system, comprises modified polycarbonate resin, modified acrylonitrile styrene acrylate resin, basalt fiber, low-dielectric glass fiber, filler with hollow structure, toughening modifier, halogen-free flame retardant and weather resistance agent.

LI C

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J