国家/地区 美国（3）
IPC部 C（3） B（2） H（2）
IPC大类 C08（3） C09（3） B82（2）
H01（2）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年 2012（3）
申请年 2011（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Composition, useful for coating a substrate e.g. glass, lens, metals, fabrics, textiles, ceramics, silicon surfaces, cardboard, paperboard, cellulose-based materials, wood and paper, comprises graphene sheets, binder, and polyalkylene imine.

SCHEFFER D, VARMA V, MONIE S

Solubilizing allotropes of carbon comprises providing a solute of fullerene, graphene or polymer of fullerene, combining with terpene, lactone or alcohol; providing cavitation, and ultracentrifuging to yield a true solution.

ROSTRO B, KOHANLOO M