国家/地区 中国（3）
IPC部 C（3）
IPC大类 C01（3） C08（3） C09（2）
IPC小类 C01B（3）
IPC C08K003/04（3）
发明人
公开年 2018（2）
申请年 2017（3）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparing graphene composite material involves preparing dopamine hydrochloric acid buffer solution, adjusting pH value, dipping salix cellulose dipped in the buffer solution at room temperature, washing by de-ionized water.

QIAN Y, ZHAO B

Preparing graphene heat conducting silicone pad involves taking metal foil, growing single layer graphene film by using chemical vapor deposition method on surface of metal foil to obtain graphene film/metal foil.

YE E, LIN J, HUANG Y, JIAO W, ZHANG X, CHEN W