国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B22（2）
IPC小类 B22F（2）
IPC C01B032/182（2）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Making graphene-reinforced inorganic matrix composite, comprises e.g. mixing multiple particles of graphitic material and solid inorganic material, and operating apparatus for transferring graphene sheets to material particles surfaces.

ZHAMU A, JANG B Z