国家/地区 中国（3） 世界知识产权组织（2）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） C08J（3）
C09D（3） G03F（3） C08G（2）
IPC C08K003/22（4）
发明人
公开年 2021（2）
申请年 2019（2） 
专利权人

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Heat-conducting antistatic silicon rubber comprises solid methyl vinyl silicone rubber, high heat-conducting main body material, filling agent and a reinforcing agent for bonding the curing between each material.

YANG H, LIU J, LIU Z, CAO F

Thermoconductive photosensitive material comprises photosensitive polyimide which is (co)polymer, inorganic filler e.g. alumina and graphene, and having preset particle size, and silica solution, and has preset thermal conductivity.

CAO X, GUI C

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H