国家/地区 中国（3） 韩国（2） 美国（2）
IPC部 B（5）
IPC大类 C08（5） B29（3） B32（2）
C09（2）
IPC小类 C08K（5） C08L（5） B29D（3）
C08J（3） B32B（2）
IPC C08K003/26（5）
发明人
公开年 2023（5）
申请年 2022（5）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Preparing dry sanitary towel based on high-opening suction plastic net useful for e.g. women menstrual period, comprises e.g. mixing polybutylene succinate resin, graphene composite modified starch, nano inorganic filler, antioxidant, lubricant and titanic acid ester coupling agent.

SHEN J

Preparing hydrogel for energy storage device, involves forming pre-gel comprising polymer and metal salt particles, shrinking and dehydrating pre-gel and impregnating shrunk and dehydrated pre-gel with ion solution to cross-link and rehydrate shrunk and dehydrated pre-gel to produce hydrogel.

JI D, KIM J Y, HWAN J D

Preparing internal spiral polyvinyl chloride drainage pipe, comprises e.g. bending and spiraling steel wire, extruding, injecting into brushing mechanism, carrying out spiral groove processing, forming inner spiral groove, spraying, extruding, painting and performing preliminary drying.

LIU Z