国家/地区
IPC部 B（2） C（2）
IPC大类 B32（2） C08（2）
IPC小类 B32B（2）
IPC C08K003/26（2）
发明人
公开年 2023（2）
申请年 2022（2）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X