国家/地区 韩国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K005/07（5）
发明人
公开年 2021（3）
申请年 2021（3） 
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Intermediate film used for laminated glasses for automobiles, railroad vehicles, aircraft, ships, and buildings, contains pigment.

NOHARA A, CHOU K, NAKAYAMA K, OKAJIMA M, CHOW K, MOYURU O A, ZHANG J, YE Y

Transferring graphene involves forming graphene on first substrate, forming polymer precursor mixture on second substrate, providing graphene oppositely to second substrate having polymer precursor mixture.

GU T J, JANG W, SEO Y, WHANG D, WHANG D M, SEO Y M, JANG W S

Producing silicone substrates or silicone composite substrates, comprises e.g. providing silane including alkoxysilane and/or hydroxysilane, preparing liquid oligosiloxane from silane by sol-gel reaction, and performing first crosslinking.

CLADE J, DOMANN G, LANG K

Graphene oxide barrier film used in gas-barrier barrier device and used in food packaging applications, comprises crosslinked composition comprising graphene, polymer, and crosslinking group.

ZHENG S, KATAYAMA H, SIMAVORYAN S