国家/地区 中国（5） 韩国（2）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08J（7）
IPC C08K003/04（7）
发明人 YANG J（2）
公开年 2023（7）
申请年 2022（4）  2021（2） 
专利权人

Modifying polyhydroxyalkanoate, comprises e.g. dispersing nanoparticles in liquid phase environment, and adding polyhydroxyalkanoate.

YANG J, ZHANG T, XUE M, DENG T, OUYANG Y, XU X, WU Y

Preparing environmentally-friendly composite material of ecological material combined with graphene rubber foaming, comprises e.g. placing the graphene rubber foaming sheet on the first conveying belt, pressing the heated corn powder sheet on sheet, and performing hot-pressing embedding and fixing.

DING Y, DING D, DING T

Functional breathable reflective film useful for fruits for preventing damage comprises linear low density polyethylene, low density polyethylene having, inorganic particles surface-coated with saturated fatty acids, and graphene.

HANMYUNGDONG

Transparent polyethylene terephthalate film comprises e.g. fluororubber, nano titanium dioxide, diatomaceous earth powder, zinc stearate, straw, talc, glass fiber, magnesium oxide, benzoic acid, hexamethylcyclotrisilazane, and graphene.

HUANG M, LIU Z

Thermoplastic composite material with heat accumulation function of heat release, has infrared heat reflection protective coating on thermoplastic elastomer surface, where elastomer has phase change material, random thermoplastic vulcanizate polypropylene, low-density polyethylene and graphene.

LIU H

Sealing ring with strong weather resistance and high temperature resistance comprises banburying the raw materials natural rubber, nitrile rubber, modifier, kneading, pouring the heated raw materials, injection molding, vulcanizing, demolding and fine grinding of rough billet.

ZHU J, YANG J, XIAO F

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K