国家/地区 中国（7）
IPC部 C（7） B（2） G（2）
IPC大类 C08（7） C09（7） B32（2）
G01（2）
IPC小类 C08K（7）
IPC C08K007/06（7）
发明人
公开年 2021（7）
申请年 2020（4）  2021（2） 
专利权人

Preparing millimeter-scale core-shell structure sphere material involves feeding polystyrene foam balls into rotary drum, adjusting working temperature of rotary drum, and adding low-density material into rotary drum.

DENG Z, ZENG J, YANG Y, XU Z, LI S, WU W, ZHANG H, LI H, WANG H, DAI Z, YI J, TANG B, CAO M

Composite material integrated with transient state, bearing and hiding for unmanned aerial vehicle, comprises phase change substrate and enhanced phase comprising mechanically enhanced phase, thermally conductive enhanced phase, photo-thermal enhanced phase and wave-absorbing enhanced phase.

LIU D, XIE W, CHENG H

Coating composition useful for improving waterproof performance, comprises calcium-based flame retardant, carbon-based flame retardant, adhesive and solvent.

PIAO K, JUNG C, JIN Z, PARK G, CHEONG C S, HYOK K J

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

High toughness nose clip aluminum alloy profile for masks, contains aluminum alloy substrate containing chromium, molybdenum, tungsten, silicon, rhenium, titanium, zirconium, iron, boron, germanium, nano silicon carbide, and aluminum.

PAN Z, SUN J, ZHANG X

Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.

JIANG Z, LI W

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E