国家/地区 日本（3）
IPC部 C（3）
IPC大类 C08（3） C01（2） C09（2）
IPC小类 C08K（3） C01B（2） C08L（2）
C09C（2）
IPC C08K009/02（3）
发明人 ITO G（2） ZAIMA H（2）
公开年 2020（3）
申请年 2019（2） 
专利权人

Heat conductive resin composition used as sealing material and packaging material, comprises resin, and filler having thermal conductivity dispersed in resin, where filler comprises graphene oxide-coated aluminum oxide particles.

TSUKADA Y, ITO Y, MIZUTA Y, KIBA S, ZAIMA H, ITO G, NISHIURA K

Composite of matter used in composite material as filler, comprises a functionalized graphene derivative having at least one functional group bonded through a chemical linker to graphene surface, where functional group is amine or alkene.

BEH E S M, IFTIME G, WEI J, PANDEY R, RIVEST J L B, EUGENESHINMINGBEH, JUNHUA W, RAHUL P

Graphene oxide-modified aluminum nitride used in resin composition, has graphene oxide layer on the surface of aluminum nitride particles.

ZAIMA H, ONAKA A, ITO G