国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2） C09（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年 2023（2）
申请年 2022（2） 
专利权人

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Hollow micro-sphere composition heat-conducting covered filler by low-dimensional nano-high heat-conducting material useful in heat-conducting aspect, comprises nano-high heat-conducting material comprising electrostatic interaction, chemical bond action and solvent hydrogen bond interaction.

LIU T, HUANG X