国家/地区 中国（4） 台湾（2） 美国（2）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC C08L009/00（4）
发明人
公开年 2021（4）
申请年 2020（2）  2021（2） 
专利权人

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Ultra-high pressure hydraulic hose comprises inner rubber layer, buffer layer, winding layer, middle rubber layer and outer rubber layer arranged in order from inside to outside, where buffer layer corrugated and filled with multiple magnetic beads.

GUO J, BAO W, PANG F, LI P, YUE B, ZHANG F, YAN K, WU Z

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Conductive cushioning material for new energy vehicles comprises base material comprising silicone rubber, carbon fiber, conductive filler, defoamer comprising physical defoamer or chemical defoamer, and catalyst.

TANG C