国家/地区
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2） C08L（2）
IPC C08K003/04（2）
发明人
公开年 2023（2）
申请年 2022（2）
专利权人

Nanofield material composition used to prepare thermal interface which is used in field of LEDs, electronic devices, and heat sinks and heat pipes comprises carbon precursor, charge-conducting particles, polymer base, and additives.

NISTA S V G, MENDES L G, MOSHKALEV S, SAVU R

Heat conducting silica gel sheet, comprises silicone rubber, graphene, dispersant, coupling agent, curing agent, and fiber filler, where dispersant includes polyvinyl alcohol, polyamide, polyvinyl acetate, polyurethane and polyacrylate.

ZENG C, WU X, CHENG X, CHAI J, LIU C