国家/地区 韩国（2） 美国（2）
IPC部 B（2）
IPC大类 B82（2） C08（2） C09（2）
IPC小类 B82B（2）
IPC B82B003/00（2）
发明人
公开年
申请年 2012（2）
专利权人

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S