国家/地区 韩国（7）
IPC部 C（7）
IPC大类 C08（7） B29（3） C09（2）
H01（2）
IPC小类 C08K（7）
IPC C08L077/00（7）
发明人 KIM H S（2） LEE G J（2）
公开年 2022（4） 2021（2）
申请年 2021（7）
专利权人 NEO ENPLA CO.（2）

Engineering plastic composition useful as engineering plastic in office automation devices, information/communication devices, electrical and electronic devices comprises polyethylene terephthalate, polyamide, glass fiber and dispersant.

KIM H S, LEE G J, PARK Y G

Method for selective laser sintering for three-dimensional article, involves depositing carbon nanomaterial-graft-polyamide particles with other thermoplastic polymer particles, and exposing to laser to fuse polymer particles and form consolidated component by selective laser sintering.

SRISKANDHA S E, FARRUGIA V M, EMPARUZIA V, SIBANTIISWARISLISKANDA, SRISKANDAR S E

Composite resin composition is useful in wigs for decoration and protection from sunlight, comprises synthetic resin mixture, polyester polyamide, graphene aqueous solution, compatibilizer, antioxidant and dispersant.

KIM H S, LEE G J

Resin composition useful for manufacturing and molding tap connector, comprises water channel insertion, rotating packing fastening part and packing fixing piece.

SEOK S C

Nylon film used as outer resin layer for aluminum pouch film for secondary battery, comprises preset amount of carboxyl group, ketone group, and graphene including all amide functional groups on its surface.

SHIM J H, UK C S, PAKSUNGIL, JANG P G, LEE S, CHUN S W, PARK S I, LEE S S

Composite material for use in e.g. transportation, marine, and energy industries, comprises thermoplastic polymer and hybrid nanoadditive including first graphene oxide portion and second polyhedral oligomeric silesquioxane portion.

KEITH K, SEDAI B, SITES K

Frame used for electric vehicle battery module, comprises upper housing containing open lower surface, empty space in which battery module can be mounted and plastic material, and lower plate comprising metal material or thermally conductive plastic material and having preset thermal conductivity.

LEE J I, CHO M S, YOO D K, HONG Y H, KUN Y