国家/地区 世界知识产权组织（4）
IPC部 C（4）
IPC大类 C01（4） C08（4） C09（3）
C04（2） H01（2）
IPC小类 C01B（4）
IPC C08L079/08（4）
发明人
公开年 2021（4）
申请年 2019（2）  2021（2） 
专利权人

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Composite material useful for electronic device, preferably galvanic cell, supercapacitor, or fuel cell, comprises polyamide-imide, and nanoplatelets.

HODGE S A, GALHENA D T L, GALHENA D T L G

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Graphite sheet useful for electronic device, has thermal conductivity in plane direction, and thermal conductivity in thickness direction.

KIM K S, WON D Y, CHOI J Y, CUI Z, YUAN D, JIN J