国家/地区 世界知识产权组织（4）
IPC部 C（4） B（3） H（3）
IPC大类 C08（4）
IPC小类 C08K（4） C09D（4） B05D（2）
B82Y（2） C08L（2） H05K（2）
IPC C08K003/04（4）
发明人 LETTOW J S（2）
公开年
申请年
专利权人 LETTOW J S（2） VORBECK MATE.（2） WALBECK MATE.（2）

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Coating composition for coated structure comprises binder system e.g. epoxy-based and/or silicate-based, zinc particles, microspheres, and conductive pigment e.g. graphite, carbon black, graphene, aluminum, black iron oxide, and/or mica.

CAMPS M B, PAULSEN A L, BARGALLO J P, VOSTRACKA T, VOSTRACKAI T, BARGALLO Y P

Composition, useful for e.g. making articles e.g. fuel filter housings, rubber goods, tires, heat sinks, pipes, sensor components and gaskets, comprises at least one polymer binder e.g. polyamide, graphene sheets, and graphite.

VARMA V, SHEFFER D, GINNEMAN C R, LETTOW J S, SCHEFFER D, SHAF D, ZINNEMAN C R

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A