国家/地区 中国（4）
IPC部 C（4） B（3） H（3）
IPC大类 C08（4） C09（4） H01（3）
C01（2） H05（2）
IPC小类 C08K（4）
IPC C09D201/00（4）
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Conductive ink useful for providing a conductive coating on a substrate, comprises a conductive polymer solution comprising conductive polymer dissolved in an aqueous-based media, and a mixture of carbon nanotubes and graphene oxide sheets.

BAO H, ZIN M, JULIUS D, LEOLUKMAN M, KIM M