国家/地区 中国（5） 欧洲专利局（EPO）（2） 韩国（2） 台湾（2） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C09J（6） C08J（3） C08K（3）
C08G（2） C08L（2） H01B（2）
IPC C09J009/02（6）
发明人 DENG X（2） LI H（2） LIU J（2）
WANG Y（2） WU X（2） XU X（2）
ZHA Y（2）
公开年 2021（2） 2022（2） 2023（2）
申请年 2021（6）
专利权人 CHANGZHOU SH.（2）

Photothermal conversion anti-corrosion adhesive tape in e.g. outdoor steel structures, comprises transparent protective layer resin including silicone resin, polyurethane resin or fluorocarbon resin, and photoelectric layer material including cadmium telluride or selenium-doped cadmium telluride.

PAN X, YANG H, CHEN F

Electrically conductive solvent cement used for coupling thermoplastic components comprises thermoplastic resin, solvent for dissolving the thermoplastic resin, and electrically conductive material.

LI Q, DAIGNEAULT L, MARTINO F

Dispersion optical composition for e.g., polymer film and polymer portion comprises a filler comprising particles, a polymerizable monomer or oligomer, and an additive.

HERB C A, MILLER D D, BZOWEJ E, MCCULLOUGH L A, MCCULLOUGH L, MILLER D, HERB C

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Electronic adhesive for packaging graphene-based semiconductor chips, comprises epoxy resin, reactive diluent, two-component curing agent, accelerator, coupling agent, aminated graphene oxide, one-dimensional carbon nanotubes, and composite powder comprising sheet and spherical silver powders.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Weather-resistant high heat-conducting graphene based epoxy resin adhesive comprises epoxy resin, reaction diluent, double-component curing agent, accelerator, coupling agent, aminated graphene oxide and tin-bismuth alloy nano particles.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X