国家/地区 中国（8） 韩国（4） 世界知识产权组织（4） 台湾（3） 欧洲专利局（EPO）（2） 美国（2）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C09J（8） C08K（5） C08G（4）
C08L（3） C08J（2） H01B（2）
H01L（2）
IPC C09J009/02（8）
发明人 ESTRUGA O M（2） ESTRUGA ORTIGA M（2） ESTRUGAORTIGAMARQUE（2）
HENCKENS A（2）
公开年 2022（8）
申请年 2022（4）  2020（2）  2021（2） 
专利权人 HENKEL AG C.（2）

Ultra-flexible high-efficiency radiating electromagnetic shielding adhesive tape for bonding electronic product parts, has graphene radiating layer comprising polyurethane resin, nano graphene sheet, filler particles and polymethyl urea resin.

WU Y, ZHANG Q

Preparing conductive material in conductive sealing strip, involves preparing graphene oxide water solution, immersing dried polyurethane foam and vacuum drying, and further immershing in mixed solution of hydriodic acid and glacial acetic acid to obtain conductive reinforcing filler water solution.

HUANG Z, XIAO Q, XIONG J, GAO R, LIAO S

Preparing epoxy resin-based thermally conductive heat-resistant conductive adhesive film, comprises e.g. mixing epoxy resin and conductive accelerator evenly, grinding them thoroughly; adding silver powder, mixing well, vacuumizing, adding diluent, coupling agent and anti-aging agent and mixing.

QIAN L, CAO J, SONG T, WANG H

Modified silver-coated copper conductive powder epoxy conductive adhesive used as eutectic tin/palladium solder in electronic package, has bisphenol A epoxy resin, sheet-shaped silver coated copper conductive powder, spherical silver coated copper conductive powder, and nitrogen doped graphene.

GAO G, XIE J, YAN M, FAN W, CHEN P

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K

Dispersion optical composition for e.g., polymer film and polymer portion comprises a filler comprising particles, a polymerizable monomer or oligomer, and an additive.

HERB C A, MILLER D D, BZOWEJ E, MCCULLOUGH L A, MCCULLOUGH L, MILLER D, HERB C

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S