国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09J（3）
IPC C09J009/02（3）
发明人 XU Z（3）
公开年 2022（3）
申请年 2022（3）
专利权人

Ultra-thin conductive adhesive film for flexible circuit board comprises release film and conductive layer comprising conductive filler, acrylic resin, diluent, isocyanate curing agent, silane coupling agent, photoinitiator, and catalyst.

LI J, XU Z, FAN S

Thermosetting composite superconducting adhesive film, comprises matrix resin, hollow core-shell structure polymer nanoparticles, functionalized graphene, multifunctional epoxy resin, acetone, dispersant, fumed silica, imidazoles, and organic amines as curing accelerator.

XU L, CAO L, YAN S, XU Z

Semi-conductive adhesive useful in e.g. preparing complex cable comprises polyperfluoroethylene propylene and/or polytetrafluoroethylene, graphite, conductive agent i.e. conductive carbon black, acetylene black, graphene, and/or carbon nanotubes, crosslinking agent and auxiliary agent.

JIANG H, FENG S, XU Y, GENG P, QIN S, XU Z, WEI W, LIU Q