国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09J（2）
IPC C09J011/04（2）
发明人 LI W（2）
公开年 2023（2）
申请年
专利权人

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

Film-coated board comprises anti-corrosion bottom sequentially, metal plate, hot melt adhesive film and polymer waterproof coiled material, high molecular waterproofing membrane and hot-melt adhesive film are respectively added with silicon micropowder.

ZHENG C, LI W, LI Z, HE M