国家/地区 中国（33） 美国（5） 韩国（3） 台湾（3） 日本（2） 世界知识产权组织（2）
IPC部 C（36）
IPC大类 C09（36） H01（20） H05（19）
C08（14） C01（7） B32（3）
B01（2） B29（2） C04（2）
C23（2）
IPC小类 C09K（36） H05K（19） C08K（13）
C08L（12） H01L（9） C01B（7）
C08J（6） H01B（6） H01M（6）
B32B（3） B01J（2） C04B（2）
C23C（2）
IPC C09K005/14（36）
发明人 LIU W（3） ZHANG J（3） CHEN X（2）
GE X（2） GUO J（2） JIANG X（2）
MA C（2） PAN Z（2） WANG H（2）
ZHANG C（2） ZHANG X（2） ZHOU M（2）
公开年 2022（36）
申请年 2022（21）  2021（13）  2020（2） 
专利权人 ANHUI AEROSP.（2） CETC NO 33 I.（2） UNIV GUANGDO.（2） UNIV SOUTH C.（2）
UNIV ZHONGSH.（2）

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Preparing thermal conductive composite film comprises graphitizing carbon nano-tube, processing carbon nano-tube into fatty acid, mixing with graphene, ball milling carbon nano tube-graphene, grinding, filtering, drying, rolling and forming.

LIU P

Preparing directional heat conductive graphite carbon film and directional heat conduction carbon part comprises dissolving soluble polyimide and graphene oxide in dimethylacetamide solvent, stirring, placing film on rolling roller, folding, pressing film, evaporating solvent and continuing pressing.

GUO H

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Preparing copper/ graphene composite material for e.g. power transmission comprises carrying out one-time hydrothermal method, adding copper salt and reducing agent into beaker , transferring solution into constant temperature water bath, performing suction filtration, washing, and vacuum drying.

MA J, DU W, PANG J, ZHANG L

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Heat-conducting and wave-absorbing integrated flexible material useful in the field of electronics, communications, automobiles, medical appliances, household appliance products, aerospace, security monitoring and navigation.

WU W, YAO Q, WU L, YANG X, TONG G

Preparing high-performance composite material, comprises performing surface treatment to graphene material, adding nano metal particles into cetyltrimethylammonium bromide solution for surface treatment, and ultrasonically dispersing.

CHEN R, FANG Q, ZHU Z, MAI Y, ZENG S, ZHANG K

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Carbon fiber thermal conduction composite material useful for thermal interface materials field, comprises e.g. carbon fiber, thermal conducting powder e.g. alumina, silicone oil, inhibitor, catalyst, aluminum powder, zinc oxide, coupling agent, phase change material e.g. paraffin and antioxidant.

FANG X, YANG S, SUN A, CAO Y