国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2） C09（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人 HE Y（2）
公开年
申请年 2022（2）
专利权人

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Flexible heat dissipation material comprises polymer masterbatch modified by hydroxylated boron nitride nanosheets; functionalized graphene; and polymer.

LI X, HE Y, GUO H