国家/地区 中国（4） 世界知识产权组织（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C09K005/14（5）
发明人
公开年 2023（4）
申请年 2022（5）
专利权人

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Preparing heat intelligent material by mixing agglomerant, heat conducting material, thermal expansion material and solvent, freezing first mixture, impregnating second mixture, curing and obtaining heat intelligent material.

WANG J, YANG Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F