国家/地区 中国（3）
IPC部 C（3） B（2）
IPC大类 C21（3）
IPC小类 C21D（3） C22F（3） B22F（2）
C22C（2）
IPC C22F001/08（3）
发明人
公开年 2021（2）
申请年 2020（3）
专利权人

Preparing high-damping copper-aluminum-manganese shape memory alloy, involves crushing copper zirconium compound inoculant ingot, mixing inoculant particles with multi-layer graphene, ball milling, drying composite powder, and solidifying.

WANG Q, JIAO Z, YIN F, ZHANG J, LIU L, JI P, YAO C

High strength high conductivity graphene-copper composite wire comprises graphene, impurity element and copper.

YANG Z, FENG X, XIE H, PENG L, HUANG G, ZHANG W, MI X

Preparation of single crystal copper substrate used for growing graphene by fixing quartz rod on spiral drive screw slide table, placing industrial copper foil on quartz rod, and sending quartz rod into quartz tube of deposition system.

WAN Q, GU Y, CHEN K