国家/地区 世界知识产权组织（2）
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C23C016/26（2）
发明人
公开年
申请年 2022（2）
专利权人

Composite material comprises substrate and coating on substrate, where coating comprises diamond-like carbon and carbonaceous multi-layered nanoparticulate.

YANG L, NEVILLE A, BINTI NIK ROSELEY N R, BRITTAIN R N, LISKIEWICZ T W

Acetylene fluid supply package for use in fabricating a semiconductor device, has pressure vessel, porous filler in the pressure vessel, improved solvent within the porous filler, where solvent solubilizing with acetylene absorbed within the improved solvent, improved solvent is triethyl phosphate.

HAN Y, CHUNG W, CHO Y, KANE W S, SONG X, SINHA A K, CHO Y J