国家/地区 中国（2）
IPC部 C（2） H（2）
IPC大类 C22（2）
IPC小类 C22F（2）
IPC C23C026/00（2）
发明人
公开年
申请年 2022（2）
专利权人

Preparing rGO/silicon dioxide coating on aluminum-magnesium-silicon alloy plate surface, comprises selecting polar plate, using computer engraving technology to engrave single-channel snake-shaped flow field, and removing oil and impurity.

SHAO C, HUANG J, YUAN B, LIU J, ZHANG L

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H