国家/地区 中国（3）
IPC部 C（3）
IPC大类 C23（3） H01（2）
IPC小类 C23C（3）
IPC C23C026/00（3）
发明人 LI C（3）
公开年 2022（3）
申请年 2022（3）
专利权人

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Anti-corrosion coating for cookware, comprises self-hydrophobic coating, transition layer formed on surface of self-hydrophobic coating and blocking layer formed on surface of transition layer, where self-hydrophobic coating and sealing layer include fluorocarbon material.

ZHANG M, YUAN H, LI C, QU Y

Preparing reduced graphene film used as active material for energy storage, preferably lithium-ion battery, involves using polyvinyl alcohol as additive, reducing graphene oxide with metal, and forming layer of graphene film on metal surface.

ZHANG S, LI T, ZHAO H, LI C, WANG R