国家/地区 中国（3）
IPC部 C（3） H（3）
IPC大类 C25（3）
IPC小类 C25D（3） H01B（3）
IPC C25D003/38（3）
发明人 WANG M（3）
公开年 2017（2）
申请年 2016（3）
专利权人 WANG M（3）

Producing copper conductive line core involves preparing electroplating solution, where electroplating solutionv has certain concentration of copper sulfate, sulfuric acid, chloride ion, surfactant and nano-graphene.

WANG M

Processing copper conductive line core involves preparing electroplating solution, where electroplating solution has certain concentration of copper sulfate, sulfuric acid, chloride ion, surfactant and nano-graphene.

WANG M

Preparing conductive wire core involves preparing plating solution by mixing copper sulfate, sulfuric acid, chloride ion, surfactant, nano-graphene and nano activated carbon and ultrasonically treating.

WANG M