国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D005/18（3）
发明人 LI Q（3）
公开年
申请年
专利权人 UNIV GUANGXI.（2）

Through-hole plating method for printed circuit boards, involves grafting graphene oxide with gamma-aminoethylaminopropyltrimethoxysilane to give product, adsorbing product of active metal ions, and electroplating.

CHEN Y, WANG Y, LI Q, HE W, WANG C, WANG S, ZHOU G, WANG Q, AI K, HU Z

Preparing silver/reduced graphene oxide composite material involves de-oiling aluminum substrate sample in degreasing liquid, after cleaning aluminum substrate sample with water, and activating degreased sample in activation solution.

HUANG Y, LIU S, SU C, QU Y, FU H, LI Q, WANG H, MA Z

Preparation of aluminum-based copper-plated graphene thin film composite material involves immersing aluminum sample in zinc solution, washing, immersing in copper bath, plating, immersing in copper-graphene solution and washing.

CHEN J, FAN H, HUANG Y, LI Q, LI Y, SUN M, WANG H, WU Y, CHEN Z, WEI X, JIE X