国家/地区
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2） F28D（2）
IPC F28D015/04（2）
发明人
公开年 2022（2）
申请年 2020（2）
专利权人

Porous 3D graphene structure used as porous wick medium in thermal systems such as vapor chambers or heat pipes used in electronic devices to enhance thermal performance.

KOSAR A, KAYA I I, SADAGHIANI A K, APAK A, APAK A M, PARLAK M, TASTAN U, BOENCUE M

Method for preparing medium transmission core in heat pipe for use in mobile phone, computer and other electronic products, involves reducing graphene oxide films by performing flame firing process, and performing high temperature thermal reduction process.

SU D, TANG Z, LU J, ZHOU R, ZHOU B