国家/地区 中国（3）
IPC部 F（3）
IPC大类 F28（3） B32（2） H01（2）
IPC小类 F28F（3） B32B（2）
IPC F28F021/08（3）
发明人
公开年 2014（2）
申请年
专利权人

Radiating table designed with special water channel of alloy material, has heat dissipation pipe fitting to water pipe through groove, heat dissipation platform provided with several waterway annular grooves communicated with water pipe through groove.

ZHAO J, HU C, HU C Q, ZHAO J H

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A