国家/地区 中国（3）
IPC部 B（5）
IPC大类 B29（5） C25（2） H05（2）
IPC小类 B29C（5） C25D（2） H05K（2）
IPC B29C045/14（5）
发明人
公开年 2022（3） 2023（2）
申请年 2022（5）
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Far-infrared radiation container for storing food, has main body provided with accommodating part, and functional part provided on inner surface or outer surface of body, where transparent material and functional material are graphene.

MIN W K

Preparing microfluidic chip through nickel composite power casting core by vacuum coating and gold-spraying conduction treating silicon female mold, placing in composite electroform liquid, electroforming, cleaning, and injection molding.

JIANG B, QIANG J, SUN H, WANG Y, WENG C

Segmented annular wire saw for cutting e.g. crystal silicon, has annular bus, where external surface annular bus is interval with multiple sand plating sections, and chip discharging groove formed between adjacent two sand plating sections.

YOU L, ZHANG Y, GONG Y