国家/地区 中国（3）
IPC部 B（4）
IPC大类 C09（4）
IPC小类 C09D（4）
IPC C09D007/65（4）
发明人 LI Y（4）
公开年 2021（2） 2022（2）
申请年 2021（3） 
专利权人

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Anti-corrosion for metal down-conductor of graphite-based grounding grid, by performing excavation which exposes metal down conductor, removing surface dust and corrosion, applying silicone rubber coating, covering with polyethylene isolation film, and leading down-conducting wire for soil filling.

ZHANG G, WANG X, ZHU J, DU J, ZHAO Y, GENG J, ZHANG Y, YAO D, KOU X, LI Y, TANG L, XIE W, MA Y, DONG M

Composite material based on an organometallic framework comprises graphene and organometallic framework materials grown in situ on the surface of grapheme.

YAN W, LI Y, HAO J, QIAN Y, TAO Y, LUO Y, YANG J

Self-testing capsule for aqueous anticorrosive coatings, comprises capsule wall and capsule core includes aqueous paint repair agent, and color developer.

LI Y