国家/地区 韩国（4）
IPC部 B（4）
IPC大类 B32（4） C08（4）
IPC小类 B32B（4）
IPC C08K003/04（4）
发明人
公开年 2022（2） 2023（2）
申请年 2022（4）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H

Nylon film used for forming outer resin layer for aluminum pouch film, comprises graphene containing all of carboxyl, ketone, and amide functional groups on surface and has preset average diameter.

SHIM J H, UK C S, PAKSUNGIL, JANG P G, LEE S