国家/地区 美国（3） 中国（2） 台湾（2）
IPC部 B（3）
IPC大类 C01（3） B82（2）
IPC小类 C01B（3）
IPC C01B031/04（3）
发明人 CHEN J（3）
公开年 2015（2）
申请年
专利权人 HSIEH C（3）

Graphene polymer composite material used in electronic technologies e.g. semiconductor, comprises nano graphene sheet(s) dispersed in matrix resin and in contact with each other through filler, in specific weight ratio.

WU M Y, HSIEH C, CHEN J, HSIEH S, XIE S, WU Y, XIE C, HSIEH C Y, CHEN J R, HSIEH S L

Graphene dissipation structure for e.g. heat dissipation devices, has substrate containing surfaces, and graphene dissipation layer containing surface-modified graphene nano sheets, carrier resin and filler, in specified weight ratio.

WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, XIE S, WU Y, XIE C, LI G, HSIEH C Y, CHEN J R, HSIEH S L, LI K T

Preparing graphene, involves oxidizing graphite material, dispersing graphite oxide in water, and adding dispersing agent and acidic reducing agent to graphite oxide aqueous suspension so that graphite oxide is reduced to graphene.

WU Y, HSIEH C, PENG C, CHEN J, LIN J, LIN G