国家/地区 美国（3）
IPC部 B（3）
IPC大类 C09（3） H01（3） B29（2）
B33（2） G01（2） H05（2）
IPC小类 C09D（3）
IPC C09D011/52（3）
发明人
公开年 2022（2）
申请年 2022（3）
专利权人

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M