国家/地区 中国（6） 日本（2） 美国（2）
IPC部 B（6）
IPC大类 C09（6） C08（3） B05（2）
B29（2） B32（2） B65（2）
B82（2） C23（2）
IPC小类 C09D（6）
IPC B32B027/30（2） B65D065/40（2） B82Y030/00（2）
B82Y040/00（2） C08K003/04（2） C09D007/12（2）
C09D007/40（2） C09D007/61（2） C09D011/52（2）
C09D163/00（2）
发明人 CHEN C（6）
公开年 2023（3）
申请年 2022（2） 
专利权人

Preparing heat-conducting coating of main cooling roller by grinding epoxy resin, bentonite, zinc powder and solvent, adding graphene, carbon nano tubes and concentrated sulfuric acid, reacting, adding carbon nanohorns, and preparing into primer and finish paint using curing agent and diluent.

QIN Z, BAI R, HUANG W, CHEN C, YANG D, ZHANG C

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

High ductility and high temperature resistant composite food packaging film useful for food packaging or food preserving, comprises modified composite film layer which is base modified film layer, maleic anhydride graft polyethylene resin film middle layer and polyethylene outer film layer.

CHEN C

Graphene and nano-silver composite material comprises resistivity of graphene and nanosilver composite material, and is prepared by reacting graphene oxide with secondary oxidant to obtain modified graphene oxide.

GUO X, LIU Z, XIE L, LI X, CHEN C

Graphene heavy anti-corrosion coating structure comprises upper base plate, graphene/zinc powder epoxy paint layer as primer layer, epoxy mica iron paint layer as middle layer, and polyurethane coating layer as surface paint layer.

CHEN C, WAN J, CHEN J

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A