国家/地区 中国（3） 美国（3） 世界知识产权组织（3）
IPC部 B（7）
IPC大类 C09（7） B33（3） H01（3）
B29（2） B41（2） C23（2）
G01（2） H05（2）
IPC小类 C09D（7）
IPC C09D011/52（7）
发明人
公开年 2022（5） 2023（2）
申请年 2022（7）
专利权人

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Preparing conductive filler for conductive ink and curved surface heating body, comprises adding carbon nanotubes into polar solvent, and ultrasonically dispersing to obtain carbon nanotube dispersion, and emulsifying graphene and ethanol by emulsifier to obtain emulsion.

ZHOU M, PAN Z, LI L

Heating film printed with conductive ink useful in e.g. automobile field comprises protective film layer, conductive ink layer and polyimide (PI) film layer in sequence, conductive ink comprises e.g. graphene, pyromellitic dianhydride, diaminodiphenyl ether, benzene diol acrylic acid mixture.

HU L

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Graphene ink useful for printing flexible devices without high temperature post-treatment, prepared by efficiently dispersing graphene with riboflavin sodium phosphate and adding ethanol to react.

LIAN H, ZHANG R, LUO J, QI L, LI Y, LI H

Conductive ink composition used in printing conductive ink for antenna printed and electronic circuits, comprises slurry of copper nanoparticles in water.

REN S

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M