国家/地区 美国（5）
IPC部 B（5）
IPC大类 C09（5）
IPC小类 C09D（5）
IPC C09D011/037（3） C09D011/52（3） H05K003/12（3）
B05D005/12（2） B41M001/26（2） B82Y010/00（2）
B82Y030/00（2） B82Y040/00（2） C01B032/186（2）
G06F001/16（2） H05K001/03（2） H05K001/09（2）
发明人
公开年 2021（2）
申请年
专利权人 HEWLETTPACKA.（2）

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Flexible printed article used in wearable device e.g. conductive contact pad, comprises non-conductive, graphene oxide membrane base substrate, and electronic component positioned on non-conductive, graphene oxide membrane base substrate.

IONESCU R C, HOLDER H A, WITTKOPF J A, WORSLEY R, CASIRAGHI C, SHIELDS J P

Method for preparing graphene conductive film for flexible touch device, involves growing graphene layer on metal-catalyzed base, and coating polyamic acid solution layer on graphene layer, where polyimide film is formed by thermal curing.

DI Y

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A