国家/地区 台湾（8）
IPC部 B（8）
IPC大类 C09（8）
IPC小类 C09D（8）
IPC B32B027/28（2） B32B033/00（2） B82Y030/00（2）
B82Y040/00（2） C08K003/04（2） C08K003/22（2）
C09D011/037（2） C09D011/102（2） C09D163/00（2）
发明人
公开年 2022（8）
申请年 2021（6） 
专利权人

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Composite coating system used for e.g. outdoor coatings, comprises primer comprising primer composition including first resin and carbon nanotubes, and topcoat comprising topcoat composition including second resin and graphene.

SUN C, LI P, CHANG W

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Raman-detectible composition used for tagging substrate, generating code, apparatus for verifying authenticity of article and robust industrial application, comprises at least two different Raman-active two-dimensional materials.

LYNCH P, DALTON A, OGILVIE S, LARGE M, JOHNSTONE J

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F