国家/地区
IPC部 C（3）
IPC大类 F28（3）
IPC小类 F28D（3） C01B（2）
IPC F28D015/04（3）
发明人
公开年 2022（2）
申请年 2020（3）
专利权人

Porous 3D graphene structure used as porous wick medium in thermal systems such as vapor chambers or heat pipes used in electronic devices to enhance thermal performance.

KOSAR A, KAYA I I, SADAGHIANI A K, APAK A, APAK A M, PARLAK M, TASTAN U, BOENCUE M

Method for preparing medium transmission core in heat pipe for use in mobile phone, computer and other electronic products, involves reducing graphene oxide films by performing flame firing process, and performing high temperature thermal reduction process.

SU D, TANG Z, LU J, ZHOU R, ZHOU B

Method for manufacturing thermal conductive plate, involves attaching good thermal conductor containing hydrophilic graphene to surface of reinforcing portion and/or shell to form film-like hydrophilicity adhesion layer.

WU C M