国家/地区 世界知识产权组织（2）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09D（2） G06F（2）
IPC C09D005/00（2） C09D175/04（2）
发明人 WU K（3）
公开年 2022（2）
申请年 2021（3）
专利权人 HEWLETTPACKA.（2）

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

High fluidity, insulating and thermally conductive silicone grease comprises polysiloxane and modified thermally conductive filler, where preparation of modified thermally conductive filler comprises e.g. processing liquid metal and thermally conductive filler by mechanical grinding.

LI Y, DOU Z, XIE Z, FU Q, WU K

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K