国家/地区 世界知识产权组织（3）
IPC部 C（3）
IPC大类 C04（3）
IPC小类 C04B（3）
IPC C04B035/58（3）
发明人
公开年 2023（2）
申请年 2022（3）
专利权人

Ceramic heater used in semiconductor manufacturing equipment, comprises ceramic substrate comprising aluminum nitride, magnesium oxide/alumina/spinel, calcium oxide and titanium dioxide, and resistance heating element.

KIM Y H, KIM J H, PARK H Y, KIM B S, HWAN K J, SUNG K

Making molded ceramic composite material used as e.g. thermal management device by thermoforming preform by heating preform in mold to temperature greater than melting or softening temperature of ceramic matrix and applying load to mold.

ERB R, BICE J

Forming low friction, wear-resistant seal assembly comprises e.g. adding molybdenum disulfide suspended in carrier liquid and graphene oxide on seal assembly component containing seal face substrate, and depositing mixture on substrate.

SUMANT A V, MUTYALA K C, YANG J, PACHECO J, MECK K