国家/地区 美国（4）
IPC部 B（4）
IPC大类 B29（4） H05（3） B32（2）
C08（2） C09（2） G06（2）
H01（2）
IPC小类 B29C（4） H05K（3） B32B（2）
C08L（2） C09D（2） G06F（2）
IPC B29C045/14（4）
发明人
公开年 2021（2）
申请年
专利权人

Injection molding of surface portion for carbon fiber-reinforced thermoplastic composite, involves providing mold cavities, compounding fiber reinforced polyamide with acrylonitrile butadiene styrene and injecting polyurethane material.

BALTAZARYJIMENEZ A, ASTHANA S, KRULL B A

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Transfer sheet used for e.g. capacitance-type touch input device, has base sheet, thin metal film layer, and transparent conductive film layer containing graphene as main component, formed sequentially.

MORI F, TERAZONO H, TERAZONO S