国家/地区 世界知识产权组织（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08L079/08（3）
发明人
公开年 2022（3）
申请年
专利权人

Polymer composition used in semi-conductors, consumer electronics and industrial constructions, comprises polyetherimide resin, crystalline polyester resin, inherently dissipative polymer, and transesterification inhibitor.

JIANG X, ZHENG Y, CHENG Y

Powder composition for three-dimensional body, comprises predefined amount of polyimide particles having specific average particle size, formed by polymerizing diamine monomer(s) and dianhydride monomers, where polyimide particles material has specific crystallinity and glass transition temperature.

KEMPINSKI K, KERSZULIS J, CHASTAIN J C, DUIS P G, KEMPINSKI K A

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S