国家/地区 韩国（4） 中国（3）
IPC部 C（7）
IPC大类 C23（7） B22（2） C22（2）
C25（2）
IPC小类 C23C（7） B22F（2） C22C（2）
C25D（2）
IPC C23C018/34（7）
发明人 JI W（2）
公开年 2021（7）
申请年 2020（5）  2021（2） 
专利权人 SUNGJIN LOGI.（3）

Zinc-cadmium alloy composite coating for aerospace electrical component, comprises chemically deposited zinc layer, nickel plating layer, zinc-cadmium alloy plating layer, silane chromium-free passivation layer and graphene sealing layer, which are arranged on surface of aluminum alloy substrate.

LAI H, GUO C, CHEN M, XIA L

Method for ultrasonic-assisted three dimensional (3D) printing of turbocharged blades and nano-gradient coatings, involves mixing powder with composition ratio with nickel and cobalt with specified percentage of total component content of titanium carbon powder into three portions.

ZHAO C, XU S, ZHANG S, XUE X

Surface treatment of through-holes of printed circuit board such as multilayer printed circuit board, involves impregnating board containing through-holes in solution comprising charged and reduced graphene oxide, and cleaning board.

YANG W S

Preparation of graphene-enhanced nickel-based nanocomposite powder metallurgy material involves cutting graphite into sheet, nano grinding to obtain nano graphene, adding dispersant, putting into centrifuge, and mixing and blending.

OU B, XU C, WANG Q, XIONG L

Electroless plating method comprises injection molding synthetic resin material, immersing in degreasing solution containing triethanolamine and sulfuric acid and immersing in pre-etching solution containing 1,2-dimethoxypropane.

JI M G, KIM W K, SUK P S, CHAYOUNBONG

Electroless plating comprises injection molding synthetic resin material, physically etching, degreasing by immersing resin material in degreasing solution containing monomethanolamine, and pre-etching using 1,2-dimethoxypropane.

JI W

Electroless plating of synthetic resin material used as lighting components, involves degreasing injection-molded synthetic resin material in degreasing solution, chemically etching, neutralizing, and forming nickel and copper plated layers.

JI W