国家/地区
IPC部 B（2）
IPC大类 B23（2）
IPC小类 B23K（2） C25D（2）
IPC C25D007/00（2）
发明人
公开年
申请年
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Processing aluminum alloy surface involves grinding aluminum alloy, cleaning and drying, using femtosecond laser multifilament to ablate the surface of aluminum alloy and preparing a graphene coating on the aluminum alloy surface.

SU Y, ZHANG X